Rashaunda Henderson is a professor in the ECE department at The University of Texas at Dallas in Richardson, TX. She received her Ph.D. degrees in electrical engineering from The University of Michigan in Ann Arbor, MI in 1999.  After graduation she joined Motorola Semiconductor Product Sector in Tempe, AZ and worked as a research and development device engineer focusing on passive circuits integration in the microwave and mixed-signal technology labs for wireless embedded systems. She joined The University of Texas at Dallas in 2007 and leads the High Frequency Circuits and Systems Laboratory, which facilitates millimeter-wave design and development of circuits, integrated packages and antennas for wireless communication systems. Dr. Henderson is a Senior Member of the IEEE and served as the 2022 President of the IEEE Microwave Theory and Technology Society (MTT-S). She is passionate about educating the next generation students and encouraging them to seek careers in science, technology, engineering and mathematics.

Performance of Antenna-in-package (AiP) Designs at Millimeter Wave Frequencies

Antenna-in-package (AiP) has become an important solution for next generation wireless systems.  As the operating frequency of systems increases, the size of the antennas decreases and to reduce losses, interconnecting the die to the antenna at the package level has become a viable technique. This presentation will focus on the electrical and mechanical characterization of packaging substrates and over mold compounds for antenna-in-package design and reliability.  The performance of a slot bowtie antenna and E-shaped patch antenna designed to operate in G will be presented along with the characterization of these antennas fabricated in an enhanced quad flat no lead (eQFN) package. The antennas have been designed for characterization using a WR5 rectangular waveguide to package transition to eliminate any radiation that would be caused by a traditional ground-signal-ground (GSG) probe.